Von der Leyen rings in chipmaker TSMC’s Dresden plant as EU greenlights German €5bn subsidy plan

European Commission President Ursula von der Leyen attended the official groundbreaking ceremony for Taiwanese firm TSMC’s Dresden plant on Tuesday (20 August) after the institution she heads announced a €5 billion state aid scheme for the facility – a sign that the EU is redoubling its efforts to boost the bloc’s domestic semiconductor production.

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Commission President Ursula von der Leyen and TSMC CEO C.C. Wei. [picture alliance/Getty Images]

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Jacob Wulff Wold and Jonathan Packroff Euractiv 20-08-2024 16:11 5 min. read Content type: News

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Updated: 01-10-2024

Von der Leyen rings in chipmaker TSMC’s Dresden plant as EU greenlights German €5bn subsidy plan

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Von der Leyen rings in chipmaker TSMC’s Dresden plant as EU greenlights German €5bn subsidy plan

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